IPC Moisture Sensitivity Classification for Non-IC Components. Content Provider Association Connecting Electronics Industries [IPC]. IPC, PWB Assembly Sol- dering Process Guideline for. Electronic Components. • IPC, Moisture Sensitiv- ity Classification for Non-IC. Components. and Use of Moisture/Reflow Sensitive Surface Mount Devices). This standard supersedes IPC Developed by ECA, IPC and JEDEC.
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Moisture transfer refers to the fact that certain solid waste Waffle pack covers will also consists of black static dissipative material. So typically paper as it enters the waste stream Items that are gold plated or have a 16 finish or lower shall contain the following note marked on exterior of container: Items that are ESD sensitive shall be individually, electrostatically protected using appropriate industrial practices.
With the notch of the waffle pack in the upper left hand corner, parts must be loaded left to right, and top to bottom.
All waffle packs containing items that are ESD sensitive diodes, integrated circuits, etc. A rigid container that holds one 950 component.
Special Packaging Package parts per instructions specified by purchase order or subcontracts, i. These carriers shall support the body of the component, maintain all physical lead dimensions, and allow visibility of the contact shall be such that no stress is applied to the leads.
Moisture content prior to packaging shall not exceed 0. Exterior containers shall comply with uniform freight and national motor freight classification rules or regulations or other carrier rules, as applicable to the mode of transportation. Elements or components that are Class 0 Sensitive shall be clearly marked as Class 0 on the external surface of the packaging.
Packaging Requirement Codes
Documents Flashcards Grammar checker. SMI only General Requirements: Each moisture barrier bag may contain up to 10 PWBs of size in2 per side or greater, and smaller boards may be packaged up to 25 per bag.
A maximum of 5 devices shall be contained in a tray. Use of any static generating material is strictly prohibited. All components must be loaded into black static dissipative 4″x4″ waffle packs. An exception for through-hole ippc components, bulkhead-mounted connectors, and cable connectors is best commercial practice. Solid board packaging is ideal for achieving exclusive.
IPC – Moisture Sensitivity Classification for Non-IC Components
Moisture content may be assured by documented process controls or appropriate testing. Surface mount components shall be suitable for vacuum pick 95003, include caps as applicable.
For shelf life requirements beyond one year place a in the Q. Use of individual bags or containers shall be used to insure adequate protection from physical contact with other parts.
Matrix Tray General Requirements: Parts must be loaded consecutively from left to right, proceeding from top to bottom as viewed with the notch of the waffle pack positioned in the upper left hand corner with a consistent separation between rows and columns.
Waffle pack dimensions should remain the same for subsequent lots of the same component type. Basin ioc Range Province PowerPoint. The preferred cavity size should be mils. Additional information on this requirement can be found at the following site: All components must be loaded into black static dissipative 2″x2″ vacuum release trays. An ESD Package ipcc indented pockets that house the components.
Compliance Commitments related to the manufacture i;c. Each moisture barrier bag shall be marked with the part number, date code, quantity, and serial numbers of the PWBs enclosed. Parts should be pre-oriented, but must be face up. Use of newsprint, excelsior, or loosed fill expanded polystyrene is not allowed as a means of cushioning.
Packaging Requirement Codes
Gel Trays should remain the same for subsequent lots of the same component type. Waffle pack capacity should be maximized within a manufacturing lot. The Gel retention level must be the minimum required to hold the component with a mesh size that adequately supports the component and allows the component to be released with vacuum applied.
Tray covers will also consists of black static dissipative material held to the base with a one piece clip. Preferred cavity depth should not exceed more than 20 mils above the top of the component.
Gel Trays must be labeled on the cover and the bottom of the base with the supplier lot number and part number, PO number and BAE part number. This code shall only be used on product provided by through Integrated Supplier Partnering Agreements.
The lid must be capable of being removed without disturbing the parts within the tray and the part no. Suppliers should attempt to provide a best fit solution without incurring extensive tooling costs. Leaded surface mount technology electronic components must be packaged such that component lead integrity is not adversely affected during shipping by contact with the packaging.
Minimum cavity depth is the same height as that of the component. Ioc not handle with bare hands; use clean, lint free cotton gloves when handling. Matte finish waffle packs should be used if available.
All the components shall be oriented in the same direction according to polarity or pin one markings. The packaging shall allow the polarity or part number markings to be visible for each device.
Parts do not have to be pre-oriented, but must be face up.